October Training Course: Laminate Technology dealing with stringent PCB demand on Compact Size and High Speed

Date: October 20, 2017 (Friday)
Time: 2:00-5:00 PM
Venue: 東莞市柏寧長安國際酒店三樓宴會1號廳
Course Content:

1.Increase rigidity to control CTE and warpage for better DS performance

2.Resin design for low Dk_Df– high speed application and special design of micro-etch for super surface roughness in order to get fine line fabrication

3.high Modulus package materials (core) and low modulus PP for addressing warpage

4.Introduction to Low Dk/Df materials

Training Objective:

1.Laminate technology to fulfil latest electronic device requirement and deliver future development
2.Products with above technology for Specific Application

Target  Audience: Process Engineers and production supervisors in PCB industry
Introduction to speaker: Mr. Shuji Gozu obtained a Master degree from Tokyo University of Science ,he has worked for 17 years at R&D of CCL division in Hitachi. Mr. Shuji Gozu has specialized in developing Halogen free and high speed materials .He is the head of HCEM HK and GZ R&D .


English with Mandarin translation


HKPCA Members - HK$370, or RMB310 per head (tax included): The fee includes handouts and refreshments. Please settle the payment before the event, or the reserved seats will be cancelled. If more than one people of the same company signed up for the training, group discount will be offered (For corporate members only):
3 to 4 persons- HK$320 or RMB270 per head (tax included)
5 or more persons - HK$250 or RMB210 per head (tax included)
Non-members - HK$570 or RMB480 per head (tax included):
*The fee includes handouts and refreshments.


October 17,2017 (Tuesday)

HKPCA Secretariat
Susan Yuan; Tel#: (86) 755 8624 1673; Email ID: susanyuan@hkpca.org
Lily Lu; Tel#: (86) 755 8624 0033; Email ID: lilylu@hkpca.org

Attachment: October Training Course - Laminate Technology dealing with stringent PCB demand on Compact Size and High Speed

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